30% Glass Reinforced, PA4T, Electro-friendly ForTii® JTX2 has robust mechanical performance and has good reliability in thermal ageing and mechanical shocks. JTX2 has consistent performance in injection molding processing and a low risk of blistering due to its JEDEC MLS 1 rating for specified thicknesses. JTX2 is the best candidate for HB reflow headers/connectors in (automotive) electronics.

30% Glass Reinforced, PA4T, Good Flow, Electro-friendly ForTii® K11 combines excellent mechanical properties with low warpage for miniature applications such as Audio Jack and Camera Holder.

40% Glass Reinforced, PA4T, Electro-friendly ForTii® K12 combines high mechanical strength and good flowability, ideal for designs requiring dimensional stability and impact resistance. K12 is suitable for applications such as sensor housing or camera bracket.

30% Glass Reinforced, PA4T, Halogen free and free of red phosphorous, Certified V-0 at 0.4mm, Laser Direct Structuring (LDS) ForTii® LDS51B is a truly reflow compatible and halogen-free flame retardancy grade. LDS51B has superior plating performance and is compatible with a broad range of laser settings enabling high resolution and fine line capability.

30% Glass Reinforced, PA4T, Laser Direct Structuring (LDS) ForTii® LDS85B enables mechanical function integration with high impact resistance and ductility. LDS85B has very good plating performance.

35% Glass Reinforced, PA4T, Electro-friendly, Enhanced Hydrolytic Stability, for Automotive applications ForTii® MX15HR exhibits enhanced hydrolytic stability towards aggressive coolants (water/glycol, 135°C) that are used in engine's thermal management systems. It has excellent mechanical performance and weld-line resistance.

40% Glass Reinforced, PA4T, Heat Stabilized, for Automotive applications ForTii® MX2 is a high Tg PPA that outperforms in dimensional stability at elevated temperatures due to the high heat deflection temperature (HDT). MX2 has excellent fatigue performance and good chemical resistance. Design Challenge Designing structural parts | CAE Designing structural parts | high strength and stiffness solutions

50% Glass Reinforced, PA4T, Heat Stabilized, for Automotive applications ForTii® MX3 is a high Tg PPA that outperforms in dimensional stability at elevated temperatures due to the high heat deflection temperature (HDT). MX3 has excellent fatigue performance and good chemical resistance. Design Challenge Designing structural parts | CAE Designing structural parts | high strength and stiffness solutions

50% Glass Reinforced, PA4T, Suitable for NMT, Suitable for PVD ForTii® NMX33 offers excellent adhesion to NMT treated metals and high mechanical performance in metal/plastics bonding. NMX33 also has a high HDT resulting in a good thermal resistance, supporting high temperature secondary processes such as high temperature PVD.

30% Glass Reinforced, PA4T, Electro-friendly, Halogen free and free of red phosphorous, Certified V-0 at 0.2mm ForTii® T11 has optimal toughness and is the best solution for (automotive) electrical components in harsh environments to minimize the risk of cracking and to provide design freedom and product reliability in terms of thermal shock ageing >1000 cycles. T11 passes JEDEC MSL 1 reflow performance (for specified thickness), reaches CTI =800V for heavy duty components, is all-color VDE approved and has electrical RTI rating of 140°C at 0,75 mm.

30% Glass Reinforced, PA4T, Electro-friendly, Halogen free and free of red phosphorous, Certified V-0 at 0.35mm ForTii® TX1 has robust mechanical & JEDEC Level 2 performance, enabling SMT process without deformation and low risk on blistering. TX1 has stable processing behavior and is suitable for typical consumer electronics connector manufacturing such as I/O, FPC and WTB connectors.

30% Glass Reinforced, PA4T, Food Contact Quality, Drinking Water Grade ForTii® WX11-FC has excellent hydrolysis resistance, processability and surface quality and is ideal for complex and thin walled food and water contact applications. For detailed statements and information regarding food contact and water contact approvals please contact your DSM representative.

40% Glass Reinforced, PA4T, Food Contact Quality, Drinking Water Grade ForTii® WX12-FC has excellent hydrolysis resistance, processability and surface quality and is ideal for complex and thin walled food and water contact applications. For detailed statements and information regarding food contact and water contact approvals please contact your DSM representative.

50% Glass Reinforced, PA4T ForTii® XS81B has excellent impact resistance and high stiffness. It's good processing ability allow for high cosmetic requirements and good bonding in various painting process. XS81B is very suitable for mobile phone middle frame applications due to low warpage and excellent performance in tumbling tests.

PPA compound, 30% glass fiber reinforced, heat stabilized, halogens free. UL listed V0@0,4mm. Specifically designed for electrical and electronic applications that require high thermal, peak and continuous resistance together with compliance with the most stringent safety requirements, this compound is also easy to process with excellent aesthetic results. Suitable for components that need to withstand the reflow soldering process (SMT).

PPA compound, 30% glass fiber reinforced, heat stabilized, halogens free. UL listed V0@0,4mm. Specifically designed for electrical and electronic applications that require high thermal, peak and continuous resistance together with compliance with the most stringent safety requirements. Suitable for components that need to withstand the reflow soldering process (SMT).

PPA compound, 30% glass fiber reinforced, heat stabilized, halogens free. UL listed V0@0,4mm. Specifically designed for electrical and electronic applications that require high thermal, peak and continuous resistance together with compliance with the most stringent safety requirements. Suitable for components that need to withstand the reflow soldering process (SMT).

PPA compound, 30% glass fiber reinforced, heat stabilized, halogens free. UL listed V0@0,4mm. Specifically designed for electrical and electronic applications that require high thermal, peak and continuous resistance together with compliance with the most stringent safety requirements, this compound is also easy to process with excellent aesthetic results. Suitable for components that need to withstand the reflow soldering process (SMT).

This data represents typical values that have been calculated from all products classified as: Generic PPA - Carbon Fiber This information is provided for comparative purposes only.

This data represents typical values that have been calculated from all products classified as: Generic PPA - Glass Fiber This information is provided for comparative purposes only.

This data represents typical values that have been calculated from all products classified as: Generic PPA - Mineral This information is provided for comparative purposes only.

This data represents typical values that have been calculated from all products classified as: Generic PPA - PTFE This information is provided for comparative purposes only.

This data represents typical values that have been calculated from all products classified as: Generic PPA This information is provided for comparative purposes only.

High Temperature Nylon

High Temperature Nylon

10% CARBON FIBER REINFORCED PPA

10% CARBON FIBER 25% GLASS FIBER REINFORCED HEAT STABILIZED PPA

20% CARBON FIBER REINFORCED PPA