Commercial: Active

Asia Pacific

Electrical/Electronic Applications

Density / Specific Gravity, Density, Melt Mass-Flow Rate (MFR), Melt Volume-Flow Rate (MVR), Molding Shrinkage, Water Absorption Sat/23C, Water Absorption 23C/50RH, Tensile Modulus, Tensile Modulus, Tensile Strength at Yield, Tensile Stress at Yield, Tensile Strength at Break, Tensile Stress at Break, Tensile Elongation at Yield, Tensile Strain at Yield, Tensile Elongation at Break, Tensile Strain at Break, Flexural Modulus, Flexural Modulus, Flexural Stress, Flexural Strength at Yield, Taber Abrasion Resistance, Charpy Notched Impact Strength, Charpy Unnotched Impact Strength, Notched Izod Impact, Notched Izod Impact Strength, Unnotched Izod Impact Strength, Instrumented Dart Impact, Ball Indentation Hardness, DTUL (0.45 MPa) Unannealed, DTUL (264 psi) - Unannealed, DTUL (1.80 MPa) Unannealed, Vicat Softening Temperature, Vicat Softening Temperature, Ball Pressure Test, CLTE, Flow (TMA), Coefficient of Linear Thermal Expansion, Flow, CLTE, Transverse (TMA), Coefficient of Linear Thermal Expansion, Transverse, Thermal Conductivity, Surface Resistivity, Glow Wire Flammability Index, Refractive Index, Light Transmittance, Haze, Drying Temperature, Drying Time, Suggested Max Moisture, Hopper Temperature, Rear Temperature, Middle Temperature, Front Temperature, Nozzle Temperature, Processing (Melt) Temp, Mold Temperature