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LNP™ THERMOCOMP™ Compound OFC08

Generic Family: Polyphenylene Sulfide • Supplied by: SABIC
LNP THERMOCOMP OFC08 compound is based on Polyphenylene sulfide (PPS) resin containing 40% glass fiber. Added features of this grade include: High Modulus and Strength, Good Impact Strength and Ductility, Excellent Heat and Chemical Resistance, Good Electrical properties and Inherently Flame-Retardant. It is also an Easy Flow grade with Good Flash Control. Applications of this grade include electric and electronic components, and various parts requiring high strength and high heat resistant.
General Properties

Access the complete datasheet details for LNP™ THERMOCOMP™ Compound OFC08 when you create your free account with Prospector. You’ll find complete information on physical, mechanical and hardness specs.

Material Status
Commercial: Active
Documents
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E207780 - SABIC JAPAN L L C

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Drones

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SABIC Material Solutions For Conveyor Systems

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Availability
Africa & Middle East, Asia Pacific, Europe, Latin America, North America
Uses
Cell Phones
Processing Method
Injection Molding
Other Properties
Filler / Reinforcement, Features, Density / Specific Gravity, Melt Mass-Flow Rate (MFR), Melt Volume-Flow Rate (MVR), Mold Shrink, Linear-Flow, Molding Shrinkage, Water Absorption @ 24 hrs, Water Absorption 24h/23C, Water Absorption Sat/23C, Water Absorption 23C/50RH, Tensile Modulus, Tensile Modulus, Tensile Strength at Break, Tensile Stress at Break, Tensile Elongation at Break, Tensile Strain at Break, Flexural Modulus, Flexural Modulus, Flexural Strength, Flexural Stress, Charpy Notched Impact Strength, Charpy Unnotched Impact Strength, Notched Izod Impact, Notched Izod Impact Strength, Unnotched Izod Impact, Unnotched Izod Impact Strength, DTUL (66 psi) - Unannealed, DTUL (0.45 MPa) Unannealed, DTUL (264 psi) - Unannealed, DTUL (1.80 MPa) Unannealed, CLTE, Flow (TMA), Coefficient of Linear Thermal Expansion, Flow, CLTE, Transverse (TMA), Coefficient of Linear Thermal Expansion, Transverse, RTI Elec, RTI Imp, RTI Str, Dielectric Constant, Dissipation Factor, Flame Rating, Drying Temperature, Drying Time, Rear Temperature, Middle Temperature, Front Temperature, Nozzle Temperature, Processing (Melt) Temp, Mold Temperature, Back Pressure, Screw Speed, Injection Notes
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Processing

Find specific processing information for LNP™ THERMOCOMP™ Compound as well as general information for the Polyphenylene Sulfide generic family. Register or Sign In for more information.

Where To Buy

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