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Plaskon SMT-B-1LV

Generic Family: 环氧; 环氧树脂Supplied by: Cookson Electronics - Semiconductor Products
This material is an epoxy molding compound designed specifically for grid arrays (BGA/LGA). Using an improved optimized filler system, it provides a lower viscosity with higher flow characteristics than SMT-B-1. It is formulated with a unique resin system, which minimizes warpage and enables trouble-free molding onto rigid and flexible laminate substrates. Minimal dimensional change after molding, post bake and subsequent solder treatment make this compound an excellent choice for grid arrays.
General Properties

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Material Status
已商用:当前有效
Availability
北美洲
Processing Method
树脂传递成型
Other Properties
特性, 形式, 密度 / 比重, 弯曲模量, 弯曲强度, 玻璃转化温度, CLTE,流动, 导热系数, 体积电阻率, 介电强度, 介电常数, UL 阻燃等级, 极限氧指数, 补充信息, 注射说明
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Processing

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