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Duratron® T5530 PAI

Generic Family: Polyamide-imide • Supplied by: Mitsubishi Chemical Advanced Materials
Duratron® T5530 PAI Polyamide-imide is a compression molded, 30% glass reinforced grade that offers high stiffness, strength, and creep resistance. Although similar in composition to Duratron® T5030 PAI, Duratron® T5530 PAI is ideal for structural applications that support static loads for extended periods of time, at high temperatures. Additionally, Duratron® T5530 PAI exhibits superior dimensional stability up to 482° F / 250° C , making it a favored solution for precision parts in the semiconductor and electronics industry.
General Properties

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Material Status
Kommerziell: Aktiv
Documents
description

Technical Datasheet (English)

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Availability
Afrika und Mittlerer Osten, Asien Pazifik, Europa, Lateinamerika, Nordamerika
Uses
Elektrisch Anwendungen
Processing Method
Formpressen
Other Properties
Carga/refuerzo, Características, Aspecto, Densidad / Gravedad específica, Densidad, Absorción de agua @ 24 h., Absorción de agua 24 h/23°C, Absorción de agua @ sat., Absorción de agua Sat/23°C, Módulo de tensión, Módulo de tensión, Tensión, Resistencia a la tracción, Elongación en el Punto de Ruptura, Deformación por tracción en la Ruptura, Módulo de Flexión, Resistencia a la flexión, Resistencia a la flexión, Resistencia a la compresión, Esfuerzo de compresión, Coeficiente de fricción, Fuerza de Impacto Charpy Notched, Resistencia al impacto Charpy sin entalle, Resistencia al Impacto Izod con ranura, Dureza Rockwell, DTUL (264 psi) - no recocido, DTUL (1.80 MPa) no recocido, Temperatura de transición vítrea, Temperatura de transición vítrea, Coeficiente de dilatación térmica lineal (CLTE), flujo (TMA), Coeficiente de expansión térmica lineal, flujo, Conductividad térmica, Resistividad superficial, Resisitividad específica de volumen, Resistencia dieléctrica, Resistencia eléctrica, Constante dieléctrica, Constante dieléctrica, Factor de disipación, Factor de disipación, Ranking de Llama, Índice de oxígeno, Propiedades adicionales
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Processing

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