Prospector

Thermoplastic Elastomer (TPE) by EMPILON

Produto Disponibilidade Descrição do produto
EMPILON® HA272 Ásia/Pacífico
EMPILON® HAR series compound are specially designed for over-molding with engineering plastic such as ABS, PC, Nylon, PETG, PBT etc. which are commonly use in the 3C industry (Computer, Communication and Consumer electronics) as well as hand held device products for soft touch, anti-slip & vibration functional purposes. Hydrogenated Styrenic Block Copolymer is the main content of this HAR series compound, its hardness range is from Shore A 39 ~ Shore 85. They can be processed by double injection and co-extrusion machines or ordinary plastic injection machines with an insert molding process.
EMPILON® HA359 África & Oriente Médio  
EMPILON® HA40 Ásia/Pacífico
EMPILON® HAR series compound are specially designed for over-molding with engineering plastic such as ABS, PC, Nylon, PETG, PBT etc. which are commonly use in the 3C industry (Computer, Communication and Consumer electronics) as well as hand held device products for soft touch, anti-slip & vibration functional purposes. Hydrogenated Styrenic Block Copolymer is the main content of this HAR series compound, its hardness range is from Shore A 39 ~ Shore 85. They can be processed by double injection and co-extrusion machines or ordinary plastic injection machines with an insert molding process.
EMPILON® HA50 Ásia/Pacífico
EMPILON® HAR series compound are specially designed for over-molding with engineering plastic such as ABS, PC, Nylon, PETG, PBT etc. which are commonly use in the 3C industry (Computer, Communication and Consumer electronics) as well as hand held device products for soft touch, anti-slip & vibration functional purposes. Hydrogenated Styrenic Block Copolymer is the main content of this HAR series compound, its hardness range is from Shore A 39 ~ Shore 85. They can be processed by double injection and co-extrusion machines or ordinary plastic injection machines with an insert molding process.
EMPILON® HA60 Ásia/Pacífico
EMPILON® HAR series compound are specially designed for over-molding with engineering plastic such as ABS, PC, Nylon, PETG, PBT etc. which are commonly use in the 3C industry (Computer, Communication and Consumer electronics) as well as hand held device products for soft touch, anti-slip & vibration functional purposes. Hydrogenated Styrenic Block Copolymer is the main content of this HAR series compound, its hardness range is from Shore A 39 ~ Shore 85. They can be processed by double injection and co-extrusion machines or ordinary plastic injection machines with an insert molding process.
EMPILON® HA70 Ásia/Pacífico
EMPILON® HAR series compound are specially designed for over-molding with engineering plastic such as ABS, PC, Nylon, PETG, PBT etc. which are commonly use in the 3C industry (Computer, Communication and Consumer electronics) as well as hand held device products for soft touch, anti-slip & vibration functional purposes. Hydrogenated Styrenic Block Copolymer is the main content of this HAR series compound, its hardness range is from Shore A 39 ~ Shore 85. They can be processed by double injection and co-extrusion machines or ordinary plastic injection machines with an insert molding process.
EMPILON® HA80 Ásia/Pacífico
EMPILON® HAR series compound are specially designed for over-molding with engineering plastic such as ABS, PC, Nylon, PETG, PBT etc. which are commonly use in the 3C industry (Computer, Communication and Consumer electronics) as well as hand held device products for soft touch, anti-slip & vibration functional purposes. Hydrogenated Styrenic Block Copolymer is the main content of this HAR series compound, its hardness range is from Shore A 39 ~ Shore 85. They can be processed by double injection and co-extrusion machines or ordinary plastic injection machines with an insert molding process.
EMPILON® HB60 Ásia/Pacífico
EMPILON® HAR series compound are specially designed for over-molding with engineering plastic such as ABS, PC, Nylon, PETG, PBT etc. which are commonly use in the 3C industry (Computer, Communication and Consumer electronics) as well as hand held device products for soft touch, anti-slip & vibration functional purposes. Hydrogenated Styrenic Block Copolymer is the main content of this HAR series compound, its hardness range is from Shore A 39 ~ Shore 85. They can be processed by double injection and co-extrusion machines or ordinary plastic injection machines with an insert molding process.
EMPILON® HP65 Ásia/Pacífico
EMPILON® HAR series compound are specially designed for over-molding with engineering plastic such as ABS, PC, Nylon, PETG, PBT etc. which are commonly use in the 3C industry (Computer, Communication and Consumer electronics) as well as hand held device products for soft touch, anti-slip & vibration functional purposes. Hydrogenated Styrenic Block Copolymer is the main content of this HAR series compound, its hardness range is from Shore A 39 ~ Shore 85. They can be processed by double injection and co-extrusion machines or ordinary plastic injection machines with an insert molding process.
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