Prospector

Elastomère thermoplastique (TPE) by EMPILON

Produit Disponibilité Description du produit
EMPILON® HA272 Asie Pacifique
EMPILON® HAR series compound are specially designed for over-molding with engineering plastic such as ABS, PC, Nylon, PETG, PBT etc. which are commonly use in the 3C industry (Computer, Communication and Consumer electronics) as well as hand held device products for soft touch, anti-slip & vibration functional purposes. Hydrogenated Styrenic Block Copolymer is the main content of this HAR series compound, its hardness range is from Shore A 39 ~ Shore 85. They can be processed by double injection and co-extrusion machines or ordinary plastic injection machines with an insert molding process.
EMPILON® HA359 Afrique & Moyen-Orient  
EMPILON® HA40 Asie Pacifique
EMPILON® HAR series compound are specially designed for over-molding with engineering plastic such as ABS, PC, Nylon, PETG, PBT etc. which are commonly use in the 3C industry (Computer, Communication and Consumer electronics) as well as hand held device products for soft touch, anti-slip & vibration functional purposes. Hydrogenated Styrenic Block Copolymer is the main content of this HAR series compound, its hardness range is from Shore A 39 ~ Shore 85. They can be processed by double injection and co-extrusion machines or ordinary plastic injection machines with an insert molding process.
EMPILON® HA50 Asie Pacifique
EMPILON® HAR series compound are specially designed for over-molding with engineering plastic such as ABS, PC, Nylon, PETG, PBT etc. which are commonly use in the 3C industry (Computer, Communication and Consumer electronics) as well as hand held device products for soft touch, anti-slip & vibration functional purposes. Hydrogenated Styrenic Block Copolymer is the main content of this HAR series compound, its hardness range is from Shore A 39 ~ Shore 85. They can be processed by double injection and co-extrusion machines or ordinary plastic injection machines with an insert molding process.
EMPILON® HA60 Asie Pacifique
EMPILON® HAR series compound are specially designed for over-molding with engineering plastic such as ABS, PC, Nylon, PETG, PBT etc. which are commonly use in the 3C industry (Computer, Communication and Consumer electronics) as well as hand held device products for soft touch, anti-slip & vibration functional purposes. Hydrogenated Styrenic Block Copolymer is the main content of this HAR series compound, its hardness range is from Shore A 39 ~ Shore 85. They can be processed by double injection and co-extrusion machines or ordinary plastic injection machines with an insert molding process.
EMPILON® HA70 Asie Pacifique
EMPILON® HAR series compound are specially designed for over-molding with engineering plastic such as ABS, PC, Nylon, PETG, PBT etc. which are commonly use in the 3C industry (Computer, Communication and Consumer electronics) as well as hand held device products for soft touch, anti-slip & vibration functional purposes. Hydrogenated Styrenic Block Copolymer is the main content of this HAR series compound, its hardness range is from Shore A 39 ~ Shore 85. They can be processed by double injection and co-extrusion machines or ordinary plastic injection machines with an insert molding process.
EMPILON® HA80 Asie Pacifique
EMPILON® HAR series compound are specially designed for over-molding with engineering plastic such as ABS, PC, Nylon, PETG, PBT etc. which are commonly use in the 3C industry (Computer, Communication and Consumer electronics) as well as hand held device products for soft touch, anti-slip & vibration functional purposes. Hydrogenated Styrenic Block Copolymer is the main content of this HAR series compound, its hardness range is from Shore A 39 ~ Shore 85. They can be processed by double injection and co-extrusion machines or ordinary plastic injection machines with an insert molding process.
EMPILON® HB60 Asie Pacifique
EMPILON® HAR series compound are specially designed for over-molding with engineering plastic such as ABS, PC, Nylon, PETG, PBT etc. which are commonly use in the 3C industry (Computer, Communication and Consumer electronics) as well as hand held device products for soft touch, anti-slip & vibration functional purposes. Hydrogenated Styrenic Block Copolymer is the main content of this HAR series compound, its hardness range is from Shore A 39 ~ Shore 85. They can be processed by double injection and co-extrusion machines or ordinary plastic injection machines with an insert molding process.
EMPILON® HP65 Asie Pacifique
EMPILON® HAR series compound are specially designed for over-molding with engineering plastic such as ABS, PC, Nylon, PETG, PBT etc. which are commonly use in the 3C industry (Computer, Communication and Consumer electronics) as well as hand held device products for soft touch, anti-slip & vibration functional purposes. Hydrogenated Styrenic Block Copolymer is the main content of this HAR series compound, its hardness range is from Shore A 39 ~ Shore 85. They can be processed by double injection and co-extrusion machines or ordinary plastic injection machines with an insert molding process.
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