Polietileno (PE): Teslin®
Producto | Disponibilidad | Descripción del producto |
---|---|---|
Teslin® Digital 1000 | Norteamérica |
Teslin ® substrate, from PPG Industries, is a microporous, dimensionally stable, highly filled, single-layer, polyolefin synthetic material. A non-abrasive inorganic filler comprises 60 percent of the weight, and it is 65 percent air by volume. The porous, uncoated nature of Teslin substrate allows inks, adhesives, coatings, and laminating films to penetrate into its structure, forming strong interlocking bonds with the substrate.
|
Teslin® HD 1400 | Norteamérica |
Teslin ® substrate, from PPG Industries, is a microporous, dimensionally stable, highly filled, single-layer, polyolefin synthetic material. A non-abrasive inorganic filler comprises 60 percent of the weight, and it is 65 percent air by volume. The porous, uncoated nature of Teslin substrate allows inks, adhesives, coatings, and laminating films to penetrate into its structure, forming strong interlocking bonds with the substrate.
|
Teslin® SP 1000 Blue | Norteamérica |
Teslin ® substrate, from PPG Industries, is a microporous, dimensionally stable, highly filled, single-layer, polyolefin synthetic material. A non-abrasive inorganic filler comprises 60 percent of the weight, and it is 65 percent air by volume. The porous, uncoated nature of Teslin substrate allows inks, adhesives, coatings, and laminating films to penetrate into its structure, forming strong interlocking bonds with the substrate.
|
Teslin® SP 1000 | Norteamérica |
Teslin ® substrate, from PPG Industries, is a microporous, dimensionally stable, highly filled, single-layer, polyolefin synthetic material. A non-abrasive inorganic filler comprises 60 percent of the weight, and it is 65 percent air by volume. The porous, uncoated nature of Teslin substrate allows inks, adhesives, coatings, and laminating films to penetrate into its structure, forming strong interlocking bonds with the substrate.
|
Teslin® SP 1200 | Norteamérica |
Teslin ® substrate, from PPG Industries, is a microporous, dimensionally stable, highly filled, single-layer, polyolefin synthetic material. A non-abrasive inorganic filler comprises 60 percent of the weight, and it is 65 percent air by volume. The porous, uncoated nature of Teslin substrate allows inks, adhesives, coatings, and laminating films to penetrate into its structure, forming strong interlocking bonds with the substrate.
|
Teslin® SP 1400 | Norteamérica |
Teslin ® substrate, from PPG Industries, is a microporous, dimensionally stable, highly filled, single-layer, polyolefin synthetic material. A non-abrasive inorganic filler comprises 60 percent of the weight, and it is 65 percent air by volume. The porous, uncoated nature of Teslin substrate allows inks, adhesives, coatings, and laminating films to penetrate into its structure, forming strong interlocking bonds with the substrate.
|
Teslin® SP 1800 | Norteamérica |
Teslin ® substrate, from PPG Industries, is a microporous, dimensionally stable, highly filled, single-layer, polyolefin synthetic material. A non-abrasive inorganic filler comprises 60 percent of the weight, and it is 65 percent air by volume. The porous, uncoated nature of Teslin substrate allows inks, adhesives, coatings, and laminating films to penetrate into its structure, forming strong interlocking bonds with the substrate.
|
Teslin® SP 600 | Norteamérica |
Teslin ® substrate, from PPG Industries, is a microporous, dimensionally stable, highly filled, single-layer, polyolefin synthetic material. A non-abrasive inorganic filler comprises 60 percent of the weight, and it is 65 percent air by volume. The porous, uncoated nature of Teslin substrate allows inks, adhesives, coatings, and laminating films to penetrate into its structure, forming strong interlocking bonds with the substrate.
|
Teslin® SP 700 | Norteamérica |
Teslin ® substrate, from PPG Industries, is a microporous, dimensionally stable, highly filled, single-layer, polyolefin synthetic material. A non-abrasive inorganic filler comprises 60 percent of the weight, and it is 65 percent air by volume. The porous, uncoated nature of Teslin substrate allows inks, adhesives, coatings, and laminating films to penetrate into its structure, forming strong interlocking bonds with the substrate.
|
Teslin® SP 800 | Norteamérica |
Teslin ® substrate, from PPG Industries, is a microporous, dimensionally stable, highly filled, single-layer, polyolefin synthetic material. A non-abrasive inorganic filler comprises 60 percent of the weight, and it is 65 percent air by volume. The porous, uncoated nature of Teslin substrate allows inks, adhesives, coatings, and laminating films to penetrate into its structure, forming strong interlocking bonds with the substrate.
|
Teslin® SPID 1000 | Norteamérica |
Teslin ® substrate, from PPG Industries, is a microporous, dimensionally stable, highly filled, single-layer, polyolefin synthetic material. A non-abrasive inorganic filler comprises 60 percent of the weight, and it is 65 percent air by volume. The porous, uncoated nature of Teslin substrate allows inks, adhesives, coatings, and laminating films to penetrate into its structure, forming strong interlocking bonds with the substrate.
|
Teslin® SPID 1400 | Norteamérica |
Teslin ® substrate, from PPG Industries, is a microporous, dimensionally stable, highly filled, single-layer, polyolefin synthetic material. A non-abrasive inorganic filler comprises 60 percent of the weight, and it is 65 percent air by volume. The porous, uncoated nature of Teslin substrate allows inks, adhesives, coatings, and laminating films to penetrate into its structure, forming strong interlocking bonds with the substrate.
|
Teslin® U 1000 WP | Norteamérica |
Teslin ® substrate, from PPG Industries, is a microporous, dimensionally stable, highly filled, single-layer, polyolefin synthetic material. A non-abrasive inorganic filler comprises 60 percent of the weight, and it is 65 percent air by volume. The porous, uncoated nature of Teslin substrate allows inks, adhesives, coatings, and laminating films to penetrate into its structure, forming strong interlocking bonds with the substrate.
|