50-1952 is a two component silicone potting and encapsulating compound. This silicone system is designed for quick thermal transfer away from heat generating electronic devices. The 50-1952 has a simple 1:1 mix ratio, can be cured in thick sections, is non-corrosive, and reversion resistant. The black silicone resin and white activator provide an excellent visual indication of a complete mix.

50-1952 is formulated without solvents or other toxic materials. It is therefore not regulated or considered hazardous for transportation. 50-1952 is REACH and RoHS Compliant.

Features:
- Flexible
- Thermally conductive
- Solvent free
- Deep section curing (beyond 1-2 inches)
- High operating temperatures
- Easy 1:1 mix ratio

Benefits:
- Low stress on components and vibration resistant
- Quick heat dissipation extends electronic life
- No by-products released during cure and safe to handle
- No need for multiple pours due to low exotherm
- Good protection in extreme environmental applications
- Simple to use