Two-Pack Thermal Conductive Sealing LiPOLY TPS587/588/589 is a two-pack silicone material for gap filling. The viscosity and flowing is very low. The high deformation material, which can filling the gap closely, cover the tolerance, and has outstanding conductivity, makes is suitable for filling the peculiar gap. LiPOLY´s ability of research and development is providing our best thermal solution to customers, which can satisfy customer special requirement on advanced product. Features- - Thermal conductivity: 2.0/1.5/0.8 W/m*K - Tow-parts package and easy to use - Waterproof and air-tight Typical Applications- - Automotive electronics - Telecommunications - Computer and peripherals - Thermally conductive vibration dampening - Between any heat-generating component and a heat sink

Ultra Soft & Highly Thermally Conductive Gap Filler LiPOLY T-top81 is a high deflection gap pad,with outstanding thermal conductivity and low thermal resistance in formshape. T-top81 offers excellent compression, filling small air gaps on uneven surfaces, ensuring an efficient and consistent transfer of heat. T-top81 was designed for thermal modules with limited gap sizes and low compression force. Features- - Thermal conductivity: 8.0 W/m*K - High compression rate - Low thermal impedance - Silicone compound - UL 94V-0 qualified Typical Applications- - Between CPU and heat sink. - Between a component and heat sink - Flat-panel displays - Power supplies - High speed mass storage drives - Telecommunication hardware

Ultra Soft & Highly Thermally Conductive Gap Filler LiPOLY T-work8000 is a high performance thermally conductive interface pad. T-work8000 offers outstanding thermal conductivity at 15.0 W/m*K and extremely low thermal resistance under minimalforce. T-work8000 offers excellent compression, filling small air gaps and uneven surfaces, ensuring an efficient and consistent transfer of heat. T-work8000 is designed for the most demanding of applications. Features- - Thermal conductivity: 15.0 W/m*K - High compression rate - Extremely low thermal impedance Typical Applications- - Between CPU and heat sink. - Between a component and heat sink. - Flat-panel displays - Power supplies - High speed mass storage drives - Telecommunication hardware

Ultra Soft & Highly Thermally Conductive Gap Filler LiPOLY T-work9000 is a high performance thermally conductive interface pad. T-work9000 offers outstanding thermal conductivity at 20.0 W/m*K and extremely low thermal resistance under minimal force. T-work9000 offers excellent compression, filling small air gaps and uneven surfaces, ensuring an efficient and consistent transfer of heat. T-work9000 is designed for the most demanding of applications. Features- - Thermal conductivity: 20.0 W/m*K - High compression rate - Extremely low thermal impedance Typical Applications- - Between CPU and heat sink. - Between a component and heat sink. - Flat-panel displays - Power supplies - High speed mass storage drives - Telecommunication hardware