3M™ Dyneon™ Fluoroplastic Agglomerate THV 221AZ is a flexible, transparent fluoroplastic composed of tetrafluoroethylene, hexafluoropropylene, and vinylidene fluoride in the form of agglomerate or coarse powder. It is soluble in select solvents and can be used to prepare solutions to coat a range of substrates to provide surfaces with good weatherability and anti-soiling properties. This agglomerate form can also be used for compounding. Dyneon THV 221AZ processes at relatively low temperatures compared to other fluoroplastics and may not require the same level of corrosion resistant equipment as that used with higher melting fluoroplastics. However, it should be remembered that THV is a fluoroplastic and should be treated accordingly. Features and Benefits - Solvent soluble for coating applications - High transparency - Excellent flexibility - Low flammability - Melting point compatible with many substrates for co-extrusion, compounding, or coating - Bondable to itself and other substrates - Powder pre-blending is possible prior to melt compounding

ECCtreme ™ ECA 1 2000 fluoroplastic resin is a class of perfluoroplastic specifically designed for use in extreme applications requiring an operating temperature up to 300 °C (572 °F) in combination with excellent electrical properties and/or chemical resistance. Chemours developed ECCtreme ™ ECA 2000 fluoroplastic resin in response to industry demand for a melt-extrudable, high-temperature fluoroplastic resin for molding applications. ECCtreme ™ ECA 2000 fluoroplastic resin has been recognized as a 300 °C (572 °F) rated material per UL746B 2 by Underwriters Laboratories. Compared with ECCtreme ™ ECA 3000 fluoroplastic resin, ECCtreme ™ ECA 2000 fluoroplastic resin has a lower melt-flow rate (MFR), making it ideal for extruded sheet and molding applications requiring increased stress-crack resistance. ECCtreme ™ ECA 2000 fluoroplastic resin can also be extruded into sheets, rods, or tubing, as well as into compression and transfer molded parts. ECCtreme ™ ECA 2000 fluoroplastic resin can be melt-processed using standard high-temperature fluoroplastic equipment, at standard operating speeds, and possesses physical, electrical, and chemical properties characteristic of polytetrafluoroethylene (PTFE). Its features include: - UL rated for 300 °C (572 °F) - High melting point of ~320 °C (608 °F) - Excellent dielectric properties - Excellent chemical and permeation resistance In addition, ECCtreme ™ ECA 2000 fluoroplastic resin demonstrates enhanced properties (e.g., higher melting point, increased melt viscosity, improved stress crack resistance) when subjected to post-processing heat treatment as shown in Table 1. This effect, known as epitaxial co-crystallization (ECC), occurs when the resin is heated between 290–300 °C (554–572 °F) for a prolonged period. This post-processing heat treatment offers a unique combination of higher stress crack resistance in combination with higher crystallinity, which is favorable to lower permeation. Furthermore, this grade offers improved creep resistance versus conventional fluoroplastics.

ECCtreme ™ ECA 1 3000 fluoroplastic resin is a class of perfluoroplastic specifically designed for use in extreme applications requiring an operating temperature of up to 300 °C (572 °F) 2 in combination with excellent electrical properties and/or chemical resistance. ECCtreme ™ ECA 3000 fluoroplastic resin was developed in response to industry demand for a melt-extrudable, high-temperature fluoroplastic resin for wire and cable applications. ECCtreme ™ ECA 3000 fluoroplastic resin has been recognized as a 300 °C (572 °F) rated material per UL 746B 2 by UL. Compared with ECCtreme ™ ECA 4000 fluoroplastic resin, ECCtreme ™ ECA 3000 fluoroplastic resin has a lower melt-flow rate (MFR), making it ideal for constructions needing >10 mil (0.254 mm) of insulation. ECCtreme ™ ECA 3000 fluoroplastic resin can also be extruded into rods or tubing, as well as into compression, injection, and transfer molded parts. ECCtreme ™ ECA 3000 fluoroplastic resin can be melt-processed using standard high-temperature fluoroplastic equipment, at standard operating speeds, and possesses physical, electrical, and chemical properties characteristic of polytetrafluoroethylene (PTFE). Itsfeatures include: - UL rated for 300 °C (572 °F) 2 - High melting point of 320 °C (608 °F) - Excellent dielectric properties - Excellent chemical and permeation resistance - Broad wire processing window of operation In addition, ECCtreme ™ ECA 3000 fluoroplastic resin demonstrates enhanced properties (e.g., higher melting point, increased melt viscosity, improved stress crack resistance) when subjected to post-processing heat treatment as shown in the table on p. 3. This effect, known as epitaxial co-crystallization (ECC), occurs when the resin is heated between 280–300 °C (536–572 °F) for a prolonged period.

ECCtreme ™ ECA 1 4000 fluoroplastic resin is a new class of perfluoroplastic specifically designed for use in extreme applications requiring an operating temperature up to 300 °C (572 °F) 2 in combination with excellent electrical properties and/or chemical resistance. Chemours developed ECCtreme ™ ECA 4000 fluoroplastic resin in response to industry demand for a melt-extrudable, high-temperature fluoroplastic resin for wire and cable applications. ECCtreme ™ ECA 4000 fluoroplastic resin has been recognized as a 300 °C (572 °F) rated material per UL 746B2 by Underwriters Laboratories. Compared with ECCtreme ™ ECA 3000 fluoroplastic resin, ECCtreme ™ ECA 4000 fluoroplastic resin has a slightly higher melt-flow rate (MFR), making it ideal for constructions needing 2–10 mil (0.05–0.254 mm) of insulation. ECCtreme ™ ECA 4000 fluoroplastic resin can be melt-processed using standard high-temperature fluoroplastic equipment, at standard operating speeds, and possesses physical, electrical, and chemical properties characteristic of polytetrafluoroethylene (PTFE). Its features include: - UL rated for 300 °C (572 °F) 2 - High melting point of ~320 °C (608 °F) - Excellent dielectric properties - Excellent chemical and permeation resistance - Broad wire processing window of operation In addition, ECCtreme ™ ECA 4000 fluoroplastic resin demonstrates enhanced properties (e.g., higher melting point, increased melt viscosity, improved stress crack resistance) when subjected to post-processing heat treatment as shown in Table 1. This effect, known as epitaxial co-crystallization (ECC), occurs when the resin is heated between 280–300 °C (536–572 °F) for a prolonged period.

This data represents typical values that have been calculated from all products classified as: Generic Fluoropolymer This information is provided for comparative purposes only.

Fluorinated ethylene-propylene concentrated dispersion, copolymerized by tetrafluoroethylene and hexafluoropropylene, is aqueous dispersion stabilized by nonionic surfactant, and can endow FEP resin products which cannot be processed by traditional method with some unique properties. The resin in its emulsion is real thermoplastic with typical excellent properties of fluororesin: continuous operating temperature of 200°C maximum operating temperature of 240°C, and chemical inertness to almost all industrial chemicals and solvents. Its products have excellent temperature resistance, corrosion resistance, chemical inertness and electrical insulation and low friction coefficient. Execution standard: Q/DYS 004-2007

Fluorinated ethylene-propylene concentrated dispersion, copolymerized by tetrafluoroethylene and hexafluoropropylene, is aqueous dispersion stabilized by nonionic surfactant, and can endow FEP resin products which cannot be processed by traditional method with some unique properties. The resin in its emulsion is real thermoplastic with typical excellent properties of fluororesin: continuous operating temperature of 200°C maximum operating temperature of 240°C, and chemical inertness to almost all industrial chemicals and solvents. Its products have excellent temperature resistance, corrosion resistance, chemical inertness and electrical insulation and low friction coefficient. Execution standard: Q/DYS 004-2007

Fluorinated ethylene-propylene powder, as a copolymer of tetrafluoroethylene and hexafluoropropylene, has good heat stability, outstanding chemical inertness, excellent electrical insulation and low friction coefficient, and can be processed by a thermoplastic processing method. It can mix with telfon powder. Execution standard: Q/DYS 003-2007

Fluorinated ethylene-propylene powder, as a copolymer of tetrafluoroethylene and hexafluoropropylene, has good heat stability, outstanding chemical inertness, excellent electrical insulation and low friction coefficient, and can be processed by a thermoplastic processing method. It can mix with telfon powder. Execution standard: Q/DYS 003-2007

Fluorinated ethylene-propylene resin, as a copolymer of tetrafluoroethylene and hexafluoropropylene, has good heat stability, outstanding chemical inertness, excellent electrical insulation and low friction coefficient, and can be processed by a thermoplastic processing method. DS608 resin with low molecular weight and high melt index has low extrusion temperature, high extrusion velocity (5-8 times of common FEP resin), and good flexibility, fold resistance and tenacity.

Fluorinated ethylene-propylene resin, as a copolymer of tetrafluoroethylene and hexafluoropropylene, has good heat stability, outstanding chemical inertness, excellent electrical insulation and low friction coefficient, and can be processed by a thermoplastic processing method. DS608 resin with low molecular weight and high melt index has low extrusion temperature, high extrusion velocity (5-8 times of common FEP resin), and good flexibility, fold resistance and tenacity.

Fluorinated ethylene-propylene resin, as a copolymer of tetrafluoroethylene and hexafluoropropylene, has good heat stability, outstanding chemical inertness, excellent electrical insulation and low friction coefficient, and can be processed by a thermoplastic processing method. DS608 resin with low molecular weight and high melt index has low extrusion temperature, high extrusion velocity (5-8 times of common FEP resin), and good flexibility, fold resistance and tenacity.

Fluorinated ethylene-propylene resin, as a copolymer of tetrafluoroethylene and hexafluoropropylene, has good heat stability, outstanding chemical inertness, excellent electrical insulation and low friction coefficient, and can be processed by a thermoplastic processing method. DS608 resin with low molecular weight and high melt index has low extrusion temperature, high extrusion velocity (5-8 times of common FEP resin), and good flexibility, fold resistance and tenacity.

Applications: - Architecture - Metal - Industrial - Plastic - Repaint

Applications: - Architecture - Metal - Industrial - Plastic - Repaint

Applications: - Architecture - Coil Coating - Heavy Duty

NEOFLON CPT LP-1000 is a new type of fluoropolymer that has excellent permeation for organic solvent, water vapor and gasoline. Introduction - NEOFLON CPT LP-1000 is a copolymer of tetrafluoroethylene and perfluoroalkyl vinyl ether in which main chain the third monomer added. - Hot melt adhesion to the other plastics such as Polyamide with its reactive group. - Adhere directly to rubber such as NBR, ECO by cross linking during the vulcanization. - Good flexibility and excellent permeation for organic solvent, water vapor and gasoline. - It can be melt-molded as a thermoplastic resin by extrusion molding, injection molding, compression molding and the like.

NEOFLON CPT LP-1000AS is a new type of conductive fluoropolymer that has excellent permeation for organic solvent, water vapor and gasoline. Introduction - NEOFLON CPT LP-1000AS is a copolymer of tetrafluoroethylene and perfluoroalkyl vinyl ether in which main chain the third monomer added. - It is conductive. - Hot melt adhesion to the other plastics such as Polyamide with its reactive group. - Adhere directly to rubber such as NBR, ECO by cross linking during the vulcanization. - Good flexibility and excellent permeation for organic solvent, water vapor and gasoline. - It can be melt-molded as a thermoplastic resin by extrusion molding, injection molding, compression molding and the like.

NEOFLON EFEP RP4020 is a fluoropolymer that has chemical resistance and the capability to adhere to the other materials. Introduction - NEOFLON EFEP RP-4020 which owns low melting point is a copolymer of ETFE and additional third monomer. - Due to its low melting point, a laminated product such as a multi-layer tube and film with EVOH can be obtained by co-extrusion molding. - Hot melt adhesion to the other plastics such as Polyamide with its reactive group. - Excellent process ability and high transparency. - It can be melt-molded as a thermoplastic resin by extrusion molding, injection molding, compression molding and the like.

NEOFLON EFEP RP5000 is a fluoropolymer that has chemical resistance and the capability to adhere to the other materials. It has a good chemical resistance as ETFE at the same time. Introduction - NEOFLON EFEP RP-5000 which owns low melting point is a copolymer of ETFE and additional third monomer. - Due to its low melting point, a laminated product such as a multi-layer tube and film with EVOH can be obtained by co-extrusion molding. - Hot melt adhesion to the other plastics such as Polyamide with its reactive group. - Excellent process ability and the good chemical resistance as ETFE. - It can be melt-molded as a thermoplastic resin by extrusion molding, injection molding, compression molding and the like.

NEOFLON EFEP RP5000AS is a conductive fluoropolymer that can adhere to the other materials. It has a good chemical resistance as ETFE at the same time. Introduction - NEOFLON EFEP RP-5000AS which owns low melting point is a copolymer of ETFE and additional third monomer. It is conductive - Due to its low melting point, a laminated product such as a multi-layer tube and film with EVOH can be obtained by co-extrusion molding. - Hot melt adhesion to the other plastics such as Polyamide with its reactive group. - Excellent process ability and the good chemical resistance as ETFE. - It can be melt-molded as a thermoplastic resin by extrusion molding, injection molding, compression molding and the like.

Description Teflon ™ FFR 430 fluoroplastic foam resin has been developed with a superior nucleant package to provide improved foam cell structure and a broader processing window. It has the lowest melt flow (7) of the FFR resins, making it best suited for the larger plenum coax cables, particularly when lowest smoke generation is a key design consideration. The foamed insulation of Teflon ™ FFR 430 fluoroplastic foam resin provides high-speed data transmission with minimal distortion and good cable structural return loss with reduced attenuation. Teflon ™ FFR 430 offers cable designers opportunities for reducing cable size with cable weight savings or the use of larger conductors to construct low-loss cables, without the need for increased dielectric dimensions. This resin is supplied as white pellets and is used in a nitrogen gas-injected foam extrusion process to produce uniform foam cells in the insulation. Achievable cell size and void content will vary based on wall thickness and processing conditions.

Description Teflon ™ FFR 550 is a fluoroplastic resin compounded with a foam nucleating package. This resin is supplied as white pellets and is used in a nitrogen gas-injected foam extrusion process to produce uniform foam cells in the dielectric insulation. Foaming the fluoroplastic reduces its dielectric constant, providing opportunities for miniaturization and weight savings. Foamed insulation of Teflon ™ FFR 550 produces cables for high frequency signal transmission with minimal distortion. Teflon ™ FFR 550 is ideal for producing coaxial cable cores in a broad range of sizes. A typical coaxial cable core would have conductor sizes of 30 AWG or greater, wall thickness of 0.010 in or greater, with void content from 20% to 60%. These voids are closed cell in nature and range from 0.0007 in (0.018 mm) to 0.005 in (0.127 mm) in diameter. Achievable void content will vary based on wall thickness and processing conditions.

Description Teflon ™ FFR 750 is a fluoroplastic resin compounded with a foam nucleating package. This resin is supplied as white pellets and is used in a nitrogen gas-injected foam extrusion process to produce uniform foam cells in the dielectric insulation. Foaming the fluoroplastic reduces its dielectric constant, providing opportunities for miniaturization and weight savings. Foamed insulation of Teflon ™ FFR 750 produces cables for high frequency signal transmission with minimal distortion. Teflon ™ FFR 750 is ideal for producing coaxial cable cores in a broad range of sizes. A typical coaxial cable core would have conductor sizes of 30 AWG or greater, wall thickness of 0.010 in or greater, with void content from 20% to 60%. These voids are closed cell in nature and range from 0.0007 in (0.018 mm) to 0.005 in (0.127 mm) in diameter. Achievable void content will vary based on wall thickness and processing conditions.

Description Teflon ™ FFR 770 is a fluoroplastic resin compounded with a foam nucleating package. This resin is supplied as white pellets and is used in a nitrogen gas-injected foam extrusion process to produce uniform foam cells in the dielectric insulation. Foaming the fluoroplastic reduces its dielectric constant, providing opportunities for miniaturization and weight savings. Foamed insulation of Teflon ™ FFR 770 produces cables for high frequency signal transmission with minimal distortion. Teflon ™ FFR 770 is ideal for producing foamed primary dielectric insulation for twisted pair cables and miniature coaxial cables. A typical cable core would have conductor sizes of 32 AWG or greater, wall thickness of 0.004 in or greater, with void content from 20% to 65%. These voids are closed cell in nature and range from 0.0007 in (0.018 mm) to 0.0013 in (0.033 mm) in diameter. Achievable void content will vary based on wall thickness and processing conditions.

Description Teflon ™ FFR 880 fluoroplastic foam resin was developed to meet the demand for superior micro-coaxial designs required for manufacturing compact electronic devices. Foamed insulation of Teflon ™ FFR 880 fluoroplastic foam resin provides high-speed data transmissions with minimal distortion and exceptional signal return loss and attenuation performance in ultra-thin wire and cable applications. In addition, the resin’s high thermal stability and melt flow rate (nominal MFR of 42) allow for high processing speeds and excellent heat resistance. Teflon ™ FFR 880 fluoroplastic foam resin offers cable designers opportunities for miniaturization and weight savings or the use of larger conductors to construct low-loss cables, without the need for increased dielectric dimensions. Teflon ™ FFR 880 has been compounded with a proprietary foam nucleating package and is supplied as white pellets. This resin is used in a nitrogen gas-injected foam extrusion process to produce uniform foam cells in the dielectric insulation. In micro-coaxial cables using Teflon ™ FFR 880 fluoroplastic foam resin, a typical cable core would have conductor sizes of 26 AWG or smaller, wall thickness of 0.002 in or greater, with void content up to 55%. These voids are closed cell in nature and range from 0.0002 in (0.006 mm) to 0.0013 in (0.033 mm) in diameter. Achievable cell size and void content will vary based on wall thickness and processing conditions.