Nemcon™ E-series products are designed for use in ESDA electronic assembly environments where strict control of ESD and cleanliness are critical. Nemcon™ E ABS 20CF is a high modulus carbon fiber-reinforced ABS with excellent conductivity. It is suitable for a wide variety of injection molding applications, including electronic components, shipping trays, storage racks, electronic housings and work surfaces.

Nemcon H-series products are designed for use in high performance electronic assemblies where heat removal is critical to system performance. Nemcon H ABS DP116P is a thermally conductive, electrically insulating ABS compound, combining thermal conductivity with good HDT and processability. Typical Applications - Encapsulations/housings for power components. - Encapsulation of passive components. - IC thermal management components, such as heat sinks, heat spreaders, or heat pipes. - LED lighting assemblies.