Polysulfon (PSU): LNP™ THERMOCOMP™ AM Compound
Produkt | Verfügbarkeit | Produktbeschreibung |
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LNP™ THERMOCOMP™ AM Compound JC004XXAR1 | Afrika und Mittlerer Osten |
LNP THERMOCOMP AM JC004XXAR1 is a compound based on PESU (Polyethersulfone) resin containing 20% carbon fiber for Large Format Additive manufacturing (LFAM) applications needing an inherent FR, reinforcement, and a high heat amorphous solution.
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