With its broad chemical resistance, Chemraz ® 551 is ideally suited as a universal sealing material for both aqueous and dry semiconductor wafer processing and chemical/DI water distribution systems.

With the lowest outgassing profile for perfluoroelastomer materials in high-temperature applications, Chemraz ® 551 provides a cleaner process environment. Because of its reduced surface stiction, it can be used for semi-dynamic and static applications. Chemraz ® 551 remains stable at operating temperatures up to 572°F (300°C), while maintaining exceptional compression set.

Chemraz ® 551 provides a significantly wider operational band and superior compression set resistance than any other broad range perfluoroelastomer on the market.

With an upper temperature limit of 600°F (316°C), it’s the elastomer of choice for the most demanding applications from ozonated DI water to hot sulfuric resist strip.

Chemraz ® 551 withstands the extreme thermal challenges typically found in LPCVD (low-pressure chemical vapor deposition), RTP (rapid thermal process), and epitaxial deposition systems.

Chemraz ® 551's broad chemical resistance and high-temperature performance result in increased seal integrity, longer seal lifetimes, reduced downtimes, and higher wafer processing yields.