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LNP™ THERMOCOMP™ Compound EC005 - Americas

Generic Family: PolyetherimideSupplied by: SABIC
LNP THERMOCOMP EC005 compound is based on Polyetherimide (PEI) resin containing 25% carbon fiber. Added features of this grade include: Electrically Conductive.
General Properties

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Material Status
Commercial: Active
Documents
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Drones

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description

LNP compounds based on ULTEM resins

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description

SABIC Material Solutions For Conveyor Systems

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Availability
Latin America, North America
Uses
Aerospace Applications
Processing Method
Injection Molding
Other Properties
Filler / Reinforcement, Features, Also Available In, Density / Specific Gravity, Density, Mold Shrink, Linear-Flow, Mold Shrink, Linear-Trans, Molding Shrinkage, Water Absorption @ 24 hrs, Water Absorption 23C/50RH, Tensile Modulus, Tensile Modulus, Tensile Strength at Break, Tensile Stress at Break, Tensile Elongation at Break, Tensile Strain at Break, Flexural Modulus, Flexural Modulus, Flexural Strength at Yield, Flexural Strength at Break, Notched Izod Impact, Notched Izod Impact Strength, Unnotched Izod Impact, Unnotched Izod Impact Strength, Instrumented Dart Impact, Multi-Axial Instrumented Impact Energy, DTUL (66 psi) - Unannealed, DTUL (0.45 MPa) Unannealed, DTUL (264 psi) - Unannealed, DTUL (1.80 MPa) Unannealed, CLTE, Flow, CLTE, Flow (TMA), Coefficient of Linear Thermal Expansion, Flow, CLTE, Transverse, CLTE, Transverse (TMA), Coefficient of Linear Thermal Expansion, Transverse, Surface Resistivity, Volume Resistivity, Drying Temperature, Drying Time, Suggested Max Moisture, Rear Temperature, Middle Temperature, Front Temperature, Nozzle Temperature, Processing (Melt) Temp, Mold Temperature, Back Pressure, Vent Depth, Injection Notes
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Processing

Find specific processing information for LNP™ THERMOCOMP™ Compound as well as general information for the Polyetherimide generic family. Register or Sign In for more information.

Where To Buy

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